| 摘要 |
PROBLEM TO BE SOLVED: To provide a ball loading device capable of packaging fine solder balls on a large-sized substrate with an industrial level. SOLUTION: The ball loading device is constituted of a substrate mounting device 1 which mounts a substrate 6 for mounting solder balls, a ball dropping device 4 for dropping the solder balls into the opening of a mask aligned with the substrate 6 and a ball pushing device 3 having a ball pushing head for pushing the solder balls, dropped into the opening, against the substrate 6. In this case, the ball pushing head is provided with a levelness transcendency device and a plurality of fixed cameras 19a, 19b, 19c are arranged in order to measure the position of the substrate. COPYRIGHT: (C)2010,JPO&INPIT
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