发明名称 |
UNDER BUMP ROUTING LAYER METHOD AND APPARATUS |
摘要 |
Various semiconductor chip conductor structures and methods of fabricating the same are provided. In one aspect, a method of manufacturing is provided that includes forming a conductor structure on a semiconductor chip. The conductor structure has a first site electrically connected to a first redistribution layer structure and a second site electrically connected to a second redistribution layer structure. A solder structure is formed on the conductor structure. |
申请公布号 |
KR20100102635(A) |
申请公布日期 |
2010.09.24 |
申请号 |
KR20107014910 |
申请日期 |
2008.12.04 |
申请人 |
ATI TECHNOLOGIES ULC |
发明人 |
MCLELLAN NEIL;LI YUE;TOPACIO RODEN;CHEUNG TERENCE |
分类号 |
H01L21/60;H01L23/485;H01L23/525 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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