| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a highly reliable multilayer wiring board for which a conductor layer is reliably interlayer-connected through a conductor for interlayer connection formed using conductive paste, and which is superior in connection stability in the stage of a product as well, and to provide a method of manufacturing the same. <P>SOLUTION: The conductor layer 2 includes a first conductor layer 21 and a second conductor layer 22 covering the prescribed region of the first conductor and comprising a second metal which is more noble and highly corrosion resistant than the first conductor layer, and the conductor layer and a via hole conductor 4 are brought into contact with each other and electrically conducted. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
