发明名称 WIRING BOARD, AND LIGHT EMITTING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a wiring board which contributes to make a light emitting apparatus thinner and which is high in general-purpose properties, and on which a plurality of light emitting elements are connected. <P>SOLUTION: The wiring board has: an FFC (Flexible Flat Cable) 10 which has an insulating base film 11 and a conductive pattern 12 formed on a top surface of the insulating base film 11; and a through hole portion 13 which is formed by punching the conductive pattern 12 of the FFC 10 together with the insulating base film 11, and which parts the conductive pattern 12 into a plurality of conductive pattern division pieces 12a. The plurality of light emitting elements 60 are connected by each of the plurality of conductive pattern division pieces 12a to connect the plurality of light emitting elements 60 in series. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010212283(A) 申请公布日期 2010.09.24
申请号 JP20090053677 申请日期 2009.03.06
申请人 JAPAN AVIATION ELECTRONICS INDUSTRY LTD 发明人 NAITO TAKEHARU;IBARAKI KAZUAKI;KATO NOBUKAZU
分类号 H01L33/62;H01L25/04;H01L25/18;H05K1/02;H05K1/18 主分类号 H01L33/62
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