| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition, having high sensitivity and little film reduction upon development, regardless of the duration time of left-standing, from an exposure step to a post-exposure baking step. <P>SOLUTION: The photosensitive resin composition contains: (a) an alkali soluble resin; (b) a photopolymerizable compound; (c) a photopolymerization initiator; (d) a photoacid generator; and (e) a crosslinking agent that reacts by an acid. <P>COPYRIGHT: (C)2010,JPO&INPIT |
