| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the warpage of an electronic circuit module generated by mounting an electronic component on a wiring board. Ž<P>SOLUTION: In the rectangular wiring board 1, the electronic component 2 is mounted on a surface. The wiring board 1 include jumper wires 4 for reinforcement soldered to wiring patterns 111 (14), and the jumper wires 4 for reinforcement are mounted so as to cross the superpositions of supporters 32 and the wiring board 1. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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