| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of mounting a package with high heat dissipation for a high frequency module using a package in which a highly heat generating component is incorporated, and to make the high frequency module compact at low cost. SOLUTION: A metal package 3 mounted with FETs 2 and a multi-chip package 5 mounted mixedly with high frequency semiconductor chips such as a microwave integrated circuit (hereinafter an MMIC), an amplifier, a switch, and a phase unit are arranged in a module case 1. A countersink hole is bored in an outside bottom of the module case 1, female screws are provided on bottom sides of a carrier 9 and a carrier 19 of the respective packages, and the module case and carriers are fastened with a countersink screw to reduce mounting area needed to tighten the screw and also to reduce contact thermal resistance. COPYRIGHT: (C)2010,JPO&INPIT |
