发明名称 |
Package Level Tuning Techniques for Propagation Channels of High-Speed Signals |
摘要 |
Various semiconductor chip carrier substrate circuit tuning apparatus and methods are disclosed. In one aspect, a method of manufacturing is provided that includes assembling a semiconductor chip carrier substrate with a first input/output site adapted to electrically connect to an external component and a second input/output site adapted to electrically connect to an input/output site of a semiconductor chip. An inductor is placed in the semiconductor chip carrier substrate. The inductor is electrically connected between the first and second input/output sites. The inductor has a preselected inductance to reduce an impedance discontinuity between the first input/output site or the second input/output site due to coupling to a second conductor in the semiconductor chip carrier substrate.
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申请公布号 |
US2010237462(A1) |
申请公布日期 |
2010.09.23 |
申请号 |
US20090406265 |
申请日期 |
2009.03.18 |
申请人 |
BEKER BENJAMIN;FOPPIANO JAMES |
发明人 |
BEKER BENJAMIN;FOPPIANO JAMES |
分类号 |
H01L27/02;H01L21/02;H01L21/52;H01L23/00 |
主分类号 |
H01L27/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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