Dual cure adhesive, useful e.g. for bonding components in opto-electronic industry, comprises a monomeric, UV-curable adhesive component, a photoinitiator, a free isocyanate- or free silane-group containing component, and an amine

摘要

Dual cure adhesive comprises at least one monomeric, UV-curable adhesive component, at least one photoinitiator, a free isocyanate- or free silane-group containing component, and an aliphatic, aromatic and/or heterocyclic, primary, secondary and/or tertiary amine that is coordinatively fixed in a cluster.