摘要 |
Various semiconductor chip thermal interface material methods and apparatus are disclosed. In one aspect, a method of establishing thermal contact between a first semiconductor chip (15, 115) and a heat spreader (30) is provided. The method includes placing a thermal interface material layer (35, 35 ', 35 ", 35 " ', 35 " ") containing a support structure (40, 40') on the first semiconductor chip (15, 115). The heat spreader (30) is positioned proximate the thermal interface material layer (35, 35 ', 35 ", 35 " ', 35 " "). The thermal interface material layer (35, 35 ', 35 ", 35 " ', 35 "") is reflowed to establish thermal contact with both the first semiconductor chip (15, 115) and the heat spreader (30). |
申请人 |
ADVANCED MICRO DEVICES, INC.;ATI TECHNOLOGIES ULC;TOUZELBAEV, MAXAT;BLACK, BRYAN;YANG, YIZHANG;REFAI-AHMED, GAMAL |
发明人 |
TOUZELBAEV, MAXAT;BLACK, BRYAN;YANG, YIZHANG;REFAI-AHMED, GAMAL |