| 摘要 |
A semiconductor device includes a first semiconductor package having at least one first semiconductor chip and a first sealing member covering the at least one first semiconductor chip, a second semiconductor package stacked on the first semiconductor package, the second semiconductor package having at least one second semiconductor chip, leads electrically connected to the at least one second semiconductor chip, and a second sealing member covering the at least one second semiconductor chip, and at least one signal connection member disposed in the first sealing member of the first semiconductor package, the at least one signal connection member electrically connecting the at least one first semiconductor chip with the leads of the at least one second semiconductor chip.
|
