发明名称 SECURING DEVICE AND THERMAL MODULE INCORPORATING THE SAME
摘要 A thermal module includes a fin assembly, a heat spreader, a heat pipe connected between the fin assembly and the heat spreader, and a securing plate. The securing plate has at least three resilient members secured on a bottom surface thereof. Each of the resilient members has a capability to deform resiliently along a direction perpendicular to the bottom surface of the securing plate to resiliently press the heat spreader to an electronic component.
申请公布号 US2010238631(A1) 申请公布日期 2010.09.23
申请号 US20090494330 申请日期 2009.06.30
申请人 FOXCONN TECHNOLOGY CO., LTD. 发明人 KUO PO-HSUAN;LIN CHIH-HSUN
分类号 H05K7/20 主分类号 H05K7/20
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