发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
摘要 |
A semiconductor device and manufacturing method. One embodiment provides a device including a semiconductor chip. A first conductor line is placed over the semiconductor chip. An external contact pad is placed over the first conductor line. At least a portion of the first conductor line lies within a projection of the external contact pad on the semiconductor chip.
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申请公布号 |
US2010237506(A1) |
申请公布日期 |
2010.09.23 |
申请号 |
US20090408110 |
申请日期 |
2009.03.20 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
BRUNNBAUER MARKUS;POHL JENS;MEYER THORSTEN |
分类号 |
H01L23/498;H01L21/50;H01L21/768 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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