A method for manufacturing a printed wiring board (10) comprises the following steps. A core, which contains a carbon fiber reinforced plastic and has a primary through hole (3a), is formed. A first adhesive member (4a) is formed on the lower surface of the core to cover the primary through hole (3a). An insulating member is filled inside the primary through hole (3a). A second adhesive member (4b) is formed on the upper surface of the core. A third adhesive member (6a) is formed below the first adhesive member (4a). A fourth adhesive member (6b) is formed on the second adhesive member (4b). Wiring is formed on the core.
申请公布号
WO2010074121(A9)
申请公布日期
2010.09.23
申请号
WO2009JP71393
申请日期
2009.12.24
申请人
MITSUBISHI ELECTRIC CORPORATION;SAMEJIMA, SOHEI;OZAKI, TSUYOSHI;OSUGA, HIROYUKI;KUMADA, TERUHIKO