| 发明名称 |
Method and apparatus for chemical mechanical polishing including first and second polishing |
| 摘要 |
A method and apparatus for performing first and second polishings on a workpiece wherein the first and second polishings are performed using different operating parameters.
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| 申请公布号 |
US7799689(B2) |
申请公布日期 |
2010.09.21 |
| 申请号 |
US20060600723 |
申请日期 |
2006.11.17 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD |
发明人 |
WEN CHIH-MIN;LIAO CHEN-HSIANG |
| 分类号 |
H01L21/302 |
主分类号 |
H01L21/302 |
| 代理机构 |
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代理人 |
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| 主权项 |
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