| 摘要 |
PURPOSE: A chip component is provided to obtain an adhesive layer with the superior reliability by interposing a thermosetting boding sheet between a conductive sheet and a board to be mounted. CONSTITUTION: An internal electrode is stacked on an insulating board(100). A thermosetting bonding sheet(200) is stacked on the internal electrode. A conductive sheet(300) with a pre-set pattern is stacked on the thermosetting bonding sheet. The thermosetting bonding sheet includes at least one through hole which is connected with the internal electrode. The thermosetting bonding sheet adheres the conductive sheet and the insulating board.
|
