发明名称 |
LEAD FRAME AND METHOD OF MANUFACTURING THE SAME |
摘要 |
PURPOSE: A lead frame and a method for manufacturing the same are provided to effectively offset bending force for deforming the lead frame by eliminating the opposite side of a raw material through a half etching process. CONSTITUTION: A raw material with a metal plate shape is prepared through a rolling operation. A full etched region is formed by etching the whole thickness of the raw material. A pattern with a half etched region(20e), which is formed by eliminating a part of the raw material in a thickness direction, is formed on the raw material. The other part of the raw material, which is opposite to the side with the half etched region, is eliminated through a half etching process.
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申请公布号 |
KR20100101909(A) |
申请公布日期 |
2010.09.20 |
申请号 |
KR20090020350 |
申请日期 |
2009.03.10 |
申请人 |
SAMSUNG TECHWIN CO., LTD. |
发明人 |
KWON, KYEUNG DO;PARK, SANG YEARL |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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