发明名称 LEAD FRAME AND METHOD OF MANUFACTURING THE SAME
摘要 PURPOSE: A lead frame and a method for manufacturing the same are provided to effectively offset bending force for deforming the lead frame by eliminating the opposite side of a raw material through a half etching process. CONSTITUTION: A raw material with a metal plate shape is prepared through a rolling operation. A full etched region is formed by etching the whole thickness of the raw material. A pattern with a half etched region(20e), which is formed by eliminating a part of the raw material in a thickness direction, is formed on the raw material. The other part of the raw material, which is opposite to the side with the half etched region, is eliminated through a half etching process.
申请公布号 KR20100101909(A) 申请公布日期 2010.09.20
申请号 KR20090020350 申请日期 2009.03.10
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 KWON, KYEUNG DO;PARK, SANG YEARL
分类号 H01L23/495 主分类号 H01L23/495
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