| 摘要 |
FIELD: technological processes. ^ SUBSTANCE: method for manufacturing of boards from chip or fibre material, in particular chip boards, LDF, MDF, HDF and OSB boards, includes the following stages: (S2) - production of dried chip or fibre material, (S3a, S3b) - plasma treatment of dried chip or fibre material, (S4a, S4b) - application of glue onto plasma-processed chip or fibre material and (S5) - pressing chip or fibre material, on which glue is applied into boards. Technological gas used at stage (S3a, S3b) of plasma treatment contains fluorine as additional component. Board contains not more than 50 kg of hard glue per cubic metre. ^ EFFECT: invention improves quality of boards. ^ 13 cl, 1 dwg |
