发明名称 LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, DISPLAY DEVICE AND LIGHTING DEVICE
摘要 The present invention provides a light emitting device package comprising: a package body which provides chip-mounting area and includes first and second lead terminals; an LED chip which is mounted at the chip-mounting area and electrically connected to first and second lead terminals; a groove unit which is formed around the LED chip in the chip-mounting area; and a wavelength converting unit which is made of resin containing a wavelength converting material and has a fence shape defined by the groove unit to enclose the LED chip.
申请公布号 WO2010071386(A3) 申请公布日期 2010.09.16
申请号 WO2009KR07644 申请日期 2009.12.21
申请人 SAMSUNG LED CO., LTD.;JOO, SEONG-AH;LEE, HYO-JIN;PARK, IL-WOO;KIM, KYUNG-TAE 发明人 JOO, SEONG-AH;LEE, HYO-JIN;PARK, IL-WOO;KIM, KYUNG-TAE
分类号 H01L33/50;H01L33/52 主分类号 H01L33/50
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