LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, DISPLAY DEVICE AND LIGHTING DEVICE
摘要
The present invention provides a light emitting device package comprising: a package body which provides chip-mounting area and includes first and second lead terminals; an LED chip which is mounted at the chip-mounting area and electrically connected to first and second lead terminals; a groove unit which is formed around the LED chip in the chip-mounting area; and a wavelength converting unit which is made of resin containing a wavelength converting material and has a fence shape defined by the groove unit to enclose the LED chip.
申请公布号
WO2010071386(A3)
申请公布日期
2010.09.16
申请号
WO2009KR07644
申请日期
2009.12.21
申请人
SAMSUNG LED CO., LTD.;JOO, SEONG-AH;LEE, HYO-JIN;PARK, IL-WOO;KIM, KYUNG-TAE