| 摘要 |
<p>The device has a cooling body (6) i.e. plate, arranged between a component to be cooled (9) and a carrier plate (1). The plate has a recess (5) provided in an area of the body, where the recess opens a cavity (4) to a plate surface. Coolant e.g. water, flows through the cavity. The recess is completely locked at the plate surface by the cooling body so that the component stays in heat conducting contact with the coolant by a defined surface using the cooling body. The cooling body is made of a good heat conducting material such as stainless steel, aluminum, copper, silver, gold or platinum.</p> |
