| 摘要 |
Disclosed is a method for producing a printed wiring board having high dimensional stability with high productivity. The production method comprising the steps of: providing a metal laminate in which a metal layer having an inner metal layer portion and a protection layer portion is laminated on at least one side of an insulating resin layer in such a manner that the inner metal layer portion is arranged on the side of the insulating resin layer; forming a via hole on the metal layer and the insulating resin layer; performing blast processing after forming the via hole; and removing the protection layer portion after performing blast processing.
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