发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
摘要 Semiconductor devices and methods for forming the same in which damages to a low-k dielectric layer therein can be reduced or even prevented are provided. A semiconductor device is provided, comprising a substrate. A dielectric layer with at least one conductive feature therein overlies the substrate. An insulating cap layer overlies the top surface of the low-k dielectric layer adjacent to the conductive feature, wherein the insulating cap layer comprises metal ions.
申请公布号 US2010230816(A1) 申请公布日期 2010.09.16
申请号 US20100787559 申请日期 2010.05.26
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 SU HUNG-WEN;CHOU SHIH-WEI;TSAI MING-HSING
分类号 H01L23/48;H01L21/768 主分类号 H01L23/48
代理机构 代理人
主权项
地址