ETCHING DEVICE AND ETCHING METHOD

摘要

An etching device including full-cone spray nozzles which have a spray angle of 85-130º and have been arranged so that a spray from each spray nozzle has, on a surface to be etched, a pattern having an area that is at least four times the area of the region surrounded by median lines each including the point on the surface from which the center of the spray nozzle, the center being defined as the intersection of the spray axis of the spray nozzle and the surface, and the center of one of adjacent spray nozzles, the center being defined as the intersection of the spray axis of the adjacent spray nozzle and the surface, are equidistant. An etching method is provided in which the etching device is used. By using the method, a printed wiring board having a microfine conductor pattern with a nearly rectangular cross-sectional shape can be efficiently produced. With this etching device, use of an etchant containing a compound which reacts with copper to form a substance that inhibits etching can give a conductor pattern having a very nearly rectangular cross-sectional shape.