BOARD WITH BUILT-IN FUNCTION ELEMENT, METHOD OF PRODUCING SAME, AND ELECTRONIC EQUIPMENT

摘要

A board with a built-in function element and method of producing the same, which are able to keep design flexibility and low thickness while effectively reducing warping. The board with the built-in function element is provided with: a function element (1); an insulating layer (10) which buries the function element (1); and connection conductors (21, 22) for connecting the function element (1) to conductors exposed at the upper part of the insulating layer (10) or a main surface of the insulating layer (10). Further, as a means for reducing the amount of warping, the ratio of a height Tv (1) of the connection conductors (21) in one case to a height Tv (2) of the connection conductors (21) in another case is adjusted according to the placement states of the connection conductors (21, 22) which are connected to the first main surface (1A) or second main surface (1B) of the function element (1). The height Tv(1) is the height of the connection conductors (21) when formed on or forming the first main surface (1A) of the function element (1), and the height Tv (2) of the connection conductors (21) is the height when formed on or forming the second main surface (1B) of the function element (1).