| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide film which is small in hygroscopic expansion and is excellent in the dimensional stability, as making use of the excellent characteristics of the polyimide resin, and which has the high heat resistance and the satisfactory film strength and the good handleability when worked or mounted. SOLUTION: The polyimide film has, as the principal layer, a polyimide resin layer (A) which contains 50-95 mol% of a structural unit expressed by formula (1) and 5-50 mol% of the sum total of two structural units of the polyimides having bis(4-aminophenoxy)phenyl as a diamine component and which has a coefficient of hygroscopic expansion of 9 ppm/%RH or less. COPYRIGHT: (C)2010,JPO&INPIT |
