发明名称 HEAT SENSITIVE ADHESIVE MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a heat sensitive adhesive material that does not damage adhesive power or blocking resistance by stable heat-sensitive adhesive liquid. SOLUTION: The heat sensitive adhesive material is provided by installing a heat sensitive adhesive layer containing at least a thermoplastic resin and a solid plasticizer on a substrate material sheet, and it is preferable that the heat sensitive adhesive layer contains a surfactant having a sulfonate group. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010202795(A) 申请公布日期 2010.09.16
申请号 JP20090050672 申请日期 2009.03.04
申请人 RICOH CO LTD 发明人 KUGO TOMOYUKI;SHINPO HITOSHI;YAMAGUCHI TAKEHITO
分类号 C09J7/02;C08K5/42;C08L101/00;C09J11/06;C09J201/00 主分类号 C09J7/02
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