发明名称 |
HEAT SENSITIVE ADHESIVE MATERIAL |
摘要 |
PROBLEM TO BE SOLVED: To provide a heat sensitive adhesive material that does not damage adhesive power or blocking resistance by stable heat-sensitive adhesive liquid. SOLUTION: The heat sensitive adhesive material is provided by installing a heat sensitive adhesive layer containing at least a thermoplastic resin and a solid plasticizer on a substrate material sheet, and it is preferable that the heat sensitive adhesive layer contains a surfactant having a sulfonate group. COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010202795(A) |
申请公布日期 |
2010.09.16 |
申请号 |
JP20090050672 |
申请日期 |
2009.03.04 |
申请人 |
RICOH CO LTD |
发明人 |
KUGO TOMOYUKI;SHINPO HITOSHI;YAMAGUCHI TAKEHITO |
分类号 |
C09J7/02;C08K5/42;C08L101/00;C09J11/06;C09J201/00 |
主分类号 |
C09J7/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|