| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic substrate 1 that is simply structured and is mounted more simply. SOLUTION: An active surface side of a base substrate 10 is formed with a first inductance element 80 and a second inductance element 40, which differ from each other in an inductance value and an applicable frequency. The first inductance element 80 is used for transmitting power to the outside, while the second inductance element 40 is used for communicating with the outside. This eliminates the need of a connection terminal of the electronic substrate 1 and enables the simplification of its structure. As a result, the electronic substrate 1 is mounted onto a mother board more simply. COPYRIGHT: (C)2010,JPO&INPIT |
