发明名称 Befestigung eines Bauelements an einem Substrat und/oder eines Anschlusselementes an dem Bauelement und/oder an dem Substrat durch Drucksinterung
摘要 <p>The fastener has a sinter-intermediate layer (16) provided between a structural element (12) and a substrate (10) and/or between a connecting element (14) and the structural element and/or between the connecting element and the substrate. The layer compensates different thermal expansion coefficients of the substrate, the connecting element and the structural element. The layer is made of silver or silver alloy and exhibits a thickness of less than or equal to 50 micro meters. The layer is provided with through holes (18) that form a surface structure.</p>
申请公布号 DE102009022660(B3) 申请公布日期 2010.09.16
申请号 DE20091022660 申请日期 2009.05.26
申请人 SEMIKRON ELEKTRONIK GMBH &amp, CO. KG 发明人 HERRMANN, ULRICH;RADUEGE, CHRISTIAN
分类号 H01L21/58;H01L21/60;H01L23/14;H01L23/48 主分类号 H01L21/58
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