发明名称 |
Befestigung eines Bauelements an einem Substrat und/oder eines Anschlusselementes an dem Bauelement und/oder an dem Substrat durch Drucksinterung |
摘要 |
<p>The fastener has a sinter-intermediate layer (16) provided between a structural element (12) and a substrate (10) and/or between a connecting element (14) and the structural element and/or between the connecting element and the substrate. The layer compensates different thermal expansion coefficients of the substrate, the connecting element and the structural element. The layer is made of silver or silver alloy and exhibits a thickness of less than or equal to 50 micro meters. The layer is provided with through holes (18) that form a surface structure.</p> |
申请公布号 |
DE102009022660(B3) |
申请公布日期 |
2010.09.16 |
申请号 |
DE20091022660 |
申请日期 |
2009.05.26 |
申请人 |
SEMIKRON ELEKTRONIK GMBH &, CO. KG |
发明人 |
HERRMANN, ULRICH;RADUEGE, CHRISTIAN |
分类号 |
H01L21/58;H01L21/60;H01L23/14;H01L23/48 |
主分类号 |
H01L21/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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