发明名称 Thermally Optimized Mechanical Interface for Hybrid Integrated Wavelength Division Multiplexed Arrayed Transmitter
摘要 An apparatus comprising a plurality of laser dice and a heat sink positioned between the laser dice and thermally coupled to the laser dice. Also included is an apparatus comprising a chip comprising a laser core, a stopper at least partially defining a groove, wherein the stopper and the groove are positioned adjacent to the chip, and a heater located between the laser core and the groove.
申请公布号 US2010232462(A1) 申请公布日期 2010.09.16
申请号 US20090434773 申请日期 2009.05.04
申请人 FUTUREWEI TECHNOLOGIES, INC. 发明人 SHEN XIAO A.;BAI YU SHENG
分类号 H01S3/04 主分类号 H01S3/04
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