发明名称 |
Thermally Optimized Mechanical Interface for Hybrid Integrated Wavelength Division Multiplexed Arrayed Transmitter |
摘要 |
An apparatus comprising a plurality of laser dice and a heat sink positioned between the laser dice and thermally coupled to the laser dice. Also included is an apparatus comprising a chip comprising a laser core, a stopper at least partially defining a groove, wherein the stopper and the groove are positioned adjacent to the chip, and a heater located between the laser core and the groove.
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申请公布号 |
US2010232462(A1) |
申请公布日期 |
2010.09.16 |
申请号 |
US20090434773 |
申请日期 |
2009.05.04 |
申请人 |
FUTUREWEI TECHNOLOGIES, INC. |
发明人 |
SHEN XIAO A.;BAI YU SHENG |
分类号 |
H01S3/04 |
主分类号 |
H01S3/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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