SOLID-STATE IMAGE PICKUP ELEMENT, METHOD FOR MANUFACTURING SAME, AND IMAGE PICKUP DEVICE

摘要

Disclosed is a solid-state image pickup element (1) which comprises: a semiconductor layer (2) that is provided with a photodiode for photoelectric conversion; a first film (21) that has a negative fixed charge and is formed on the semiconductor layer (2) at least in the region where the photodiode is formed; and a second film (22) that has a negative fixed charge, is formed on the first film (21) that has a negative fixed charge, and is formed from a material having a negative fixed charge but being different from that of the first film (21).