发明名称 INTEGRATED CIRCUIT, 1T-1C EMBEDDED MEMORY CELL CONTAINING SAME, AND METHOD OF MANUFACTURING 1T-1C MEMORY CELL FOR EMBEDDED MEMORY APPLICATION
摘要 An integrated circuit includes a semiconducting substrate (110), electrically conductive layers (120) over the semiconducting substrate, and a capacitor (130) at least partially embedded within the semiconducting substrate such that the capacitor is entirely underneath the electrically conductive layers. A storage node voltage is on an outside layer (132) of the capacitor. In the same or another embodiment, the integrated circuit may act as a 1T-1C embedded memory cell including the semiconducting substrate, an electrically insulating stack (160) over the semiconducting substrate, a transistor (140) including a source/drain region (142) within the semiconducting substrate and a gate region (141) above the semiconducting substrate, a trench (111) extending through the electrically insulating layers and into the semiconducting substrate, a first electrically insulating layer (131) located within the trench, and the capacitor located within the trench interior to the first electrically insulating layer.
申请公布号 WO2010074948(A3) 申请公布日期 2010.09.16
申请号 WO2009US67066 申请日期 2009.12.08
申请人 INTEL CORPORATION;DOYLE, BRIAN S.;SOMASEKHAR, DINESH;DEWEY, GILBERT;SURI, SATYARTH 发明人 DOYLE, BRIAN S.;SOMASEKHAR, DINESH;DEWEY, GILBERT;SURI, SATYARTH
分类号 H01L27/108;H01L21/8242 主分类号 H01L27/108
代理机构 代理人
主权项
地址