CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, PRINTED WIRING BOARD, NEW PHENOL RESIN AND METHOD FOR PRODUCING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a curable resin composition that achieves excellent heat resistance, low thermal expansion properties and improved solvent solubility, a cured product thereof, a printed wiring board having excellent heat resistance and low thermal expansion properties, a new phenol resin providing these performances and a method for producing the same.

SOLUTION: The curable resin composition comprises an epoxy resin (A) and a phenol resin (B) that has a skeleton in which a naphthalene structure is connected to a cyclohexadienone structure through a methylene structure and a hydroxy group bonded to the naphthalene structure as essential components.

COPYRIGHT: (C)2010,JPO&INPIT