摘要 |
PROBLEM TO BE SOLVED: To provide a heat transfer unit for highly efficiently radiating the heat generated in an electronic equipment and transferred to the heat radiating part. SOLUTION: The heat transfer unit comprises: a thermoelectric element 3; a heat transfer substrate 5 for cooling fixed to the surface 3a for absorbing and transferring heat of the element 3; and a heat transfer substrate 7 for radiating heat fixed to the surface 3b for radiating and transferring heat of the element 3. A transducer 20 is provided at least either of the substrate 5 or the substrate 7. COPYRIGHT: (C)2006,JPO&NCIPI |