发明名称
摘要 PROBLEM TO BE SOLVED: To provide a heat transfer unit for highly efficiently radiating the heat generated in an electronic equipment and transferred to the heat radiating part. SOLUTION: The heat transfer unit comprises: a thermoelectric element 3; a heat transfer substrate 5 for cooling fixed to the surface 3a for absorbing and transferring heat of the element 3; and a heat transfer substrate 7 for radiating heat fixed to the surface 3b for radiating and transferring heat of the element 3. A transducer 20 is provided at least either of the substrate 5 or the substrate 7. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP4542443(B2) 申请公布日期 2010.09.15
申请号 JP20050028462 申请日期 2005.02.04
申请人 发明人
分类号 H01L23/38;H01L35/30;H05K7/20 主分类号 H01L23/38
代理机构 代理人
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