| 摘要 |
PURPOSE: A solder ball mounting device is provided to easily implement the separation of solder ball and a solder ball device by inserting air additionally in a process of separating the solder ball and the solder ball device using a vacuum device and an eject pin. CONSTITUTION: A plurality of penetration holes(220) passes through a body(210). An eject pin(230) is located within a plurality of penetration holes. A vacuum system(235) controls the vacuum within the penetration hole. An air compressor(270) injects the air into the penetration hole. A solder ball(240) is attached using the vacuum within the vacuum apparatus in a solder ball accepting unit(215).
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