发明名称 |
Thin multi-chip flex module |
摘要 |
A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The conductive patterns include a series of electrical contacts adjacent to one edge of the substrate. The substrate is bonded to two rigid frames, one on each opposite surface. Each substrate has a series of castellations on one edge that are aligned and electrically connected to the respective contacts on the substrate, preferably by soldering. The castellations can serve as a self-aligning mechanism when the module is brought into contact with a low-profile pin array, and the module may be held in place on a motherboard by guide rails in a socket that engages the edges perpendicular to the castellated edge of the module. The module may further be provided with protective heat spreading covers.
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申请公布号 |
US7796399(B2) |
申请公布日期 |
2010.09.14 |
申请号 |
US20080317892 |
申请日期 |
2008.12.30 |
申请人 |
MICROELECTRONICS ASSEMBLY TECHNOLOGIES, INC. |
发明人 |
CLAYTON JAMES E.;FATHI ZAKARYAE |
分类号 |
H05K1/18;H01L23/34;H01R12/24;H01R43/02;H04L12/50;H05K7/20 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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