发明名称 FILM DEPOSITION APPARATUS AND FILM DEPOSITION METHOD
摘要 A film formation device (10) that increases the mechanical resistance of the liquid repellent film formed on the oxide film. The film formation device (10) includes an oxide film formation unit (14, 15, 16), which forms an oxidized film on a substrate by releasing grains towards the substrate that is rotated in a vacuum chamber (11), and forms an oxide film on the substrate by emitting oxygen plasma towards the oxidized film. A vapor deposition unit (17) vapor-deposits a silane coupling agent, which contains a hydrolytic polycondensation group and a liquid repellent group, on the oxide film. A polycondensation unit (20) polycondenses the silane coupling agent by supplying water towards the oxide film on the rotated substrate. The polycondensation unit supplies water to the oxide film before the vapor deposition unit vapor deposits the silane coupling agent on the oxide film.
申请公布号 KR20100099336(A) 申请公布日期 2010.09.10
申请号 KR20107017244 申请日期 2009.04.08
申请人 ULVAC, INC. 发明人 YAMAMOTO HARUHIKO;KOKUBU KENJIRO
分类号 C23C16/44;C23C16/40;C23C16/56 主分类号 C23C16/44
代理机构 代理人
主权项
地址