| 摘要 |
PURPOSE: A wafer processing method and a wafer processing apparatus are provided to form an adhesive thin film into a constant thickness on the rear side of a wafer by applying centrifugal force with respect to the thin film. CONSTITUTION: A sustaining table unit(3) includes a sustaining table for sustaining a wafer. The sustaining table unit includes a transferring base table(31) which is movable along a pair of guiding rails(41). The sustaining table and a servomotor(35) are arranged on a sustaining table supporter(32). A screen printing unit(5) is arranged in an adhesive coating region(3A). An adhesive hardening unit(6) is arranged in an adhesive hardening region(3B). |
