| 摘要 |
<p>Provided is a surface inspecting apparatus wherein a subject to be inspected is rotated for the purpose of main scanning and is, at the same time, translated for the purpose of sub-scanning, the surface of a semiconductor wafer (100) is irradiated with illuminating light (21), an illuminating spot (3), i.e., the irradiation range of the illuminating light (21) is formed, scattered light, diffracted light and reflected light from the illuminating spot are detected, and based on the detection results, foreign materials on the surface of the semiconductor wafer (100) or inside of the wafer close to the surface are detected. The translation speed of the sub-scanning is controlled corresponding to the distance between the rotational center of the main scanning of the semiconductor wafer (100) and the illuminating spot. Thus, the inspection time can be shortened, while suppressing deterioration of detection sensitivity of the surface inspection and increase of thermal damages.</p> |
