| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for collecting plating powder of hot-dip plating, wherein process environment is improved by improving suction factor of the plating powder stripped by a support roller and effectively sucking scattered plating powder, and, as the result, an increase in yield of plated steel plate is attained. SOLUTION: The device for collecting the plating powder of hot-dip plating is provided with a dust collecting hood 2 for catching the plating powder and a connection arm 12 for synchronously moving the hood 2 in accordance with opening and closing movement of the support roller 11. The top end part of the dust collecting hood 2 is inclined to the outer side for a plated steel plate 15, and has a first suction port 13a which covers the outer periphery of the support roller 11 and sucks plating powder stripped from the support roller 11. Also, a second suction port 13b for catching scattered plating powder which can not be completely caught by the first suction port 13a, is provided on the top end part on the upper surface of the dust collecting hood 2. Further, a parting plate is provided between the first suction port 13a and the second suction port 13b. COPYRIGHT: (C)2010,JPO&INPIT |
