| 摘要 |
A process for manufacturing a printed wiring board includes specifying overlapping etches for a first portion of the printed wiring board and a second portion of the printed wiring board, the first portion of the printed wiring board having disposed thereon a printed circuit having at least one dimension critical to printed wiring board operation, etching a first conductor in the first portion of the printed wiring board when a first conductor thickness is a predetermined thickness, completing all plating steps, and etching a second conductor in the second portion of the printed wiring board.
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