| 摘要 |
A method for dismounting an electronic device that is mounted on a printed board by solder including heating the electronic device by dipping the electronic device in inert liquid heated in a heating bath and melting the solder in the through-hole using heat transferred from the electronic device. The electronic device has a terminal pin disposed in a through-hole of the printed board extending from a front surface to a back surface of the printed board. The terminal pin is joined to the printed board by the solder.
|
