发明名称 COPPER POWDER FOR ELECTROCONDUCTIVE PASTE, AND ELECTROCONDUCTIVE PASTE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a copper powder which does not impair the balance of any of oxidation resistance and electroconductivity though the particle size is very small, and further a copper powder containing little oxygen for an electroconductive paste, of which the variation in the shapes and the particle sizes is small. <P>SOLUTION: The copper powder for the electroconductive paste contains 0.05-10 atom.% Bi inside the particle and also contains 0.01-0.3 atom.% P (phosphorus) inside the particle. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010196105(A) 申请公布日期 2010.09.09
申请号 JP20090041559 申请日期 2009.02.24
申请人 MITSUI MINING & SMELTING CO LTD 发明人 ODA AKIHIRO;SEKIGUCHI MAKOTO;YOSHIMARU KATSUHIKO
分类号 B22F1/00;C22C9/00;H01B1/22;H01B5/00 主分类号 B22F1/00
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