发明名称 |
COPPER POWDER FOR ELECTROCONDUCTIVE PASTE, AND ELECTROCONDUCTIVE PASTE |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a copper powder which does not impair the balance of any of oxidation resistance and electroconductivity though the particle size is very small, and further a copper powder containing little oxygen for an electroconductive paste, of which the variation in the shapes and the particle sizes is small. <P>SOLUTION: The copper powder for the electroconductive paste contains 0.05-10 atom.% Bi inside the particle and also contains 0.01-0.3 atom.% P (phosphorus) inside the particle. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
申请公布号 |
JP2010196105(A) |
申请公布日期 |
2010.09.09 |
申请号 |
JP20090041559 |
申请日期 |
2009.02.24 |
申请人 |
MITSUI MINING & SMELTING CO LTD |
发明人 |
ODA AKIHIRO;SEKIGUCHI MAKOTO;YOSHIMARU KATSUHIKO |
分类号 |
B22F1/00;C22C9/00;H01B1/22;H01B5/00 |
主分类号 |
B22F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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