| 摘要 |
PROBLEM TO BE SOLVED: To provide a holding component allowing a holding object component to be held on a printed wiring board without bonding the holding object component with an adhesive or performing solder joining after integrating the holding component with the holding object component like the prior art. SOLUTION: The holding component 1 includes a base part fixed to the printed wiring board 20, and a first pressure bonding part 5 and a second pressure bonding part 7 protrusively provided at the base part and pressure-bonded to a holding object 25 with elastic deformation when holding the holding object 25. When the holding object 25 is introduced between the holding components 1, 1 after fixing two or more holding components 1 to the printed wiring board 20, the holding object 25 is held between the first pressure bonding part 5 of one holding component 1 and the second pressure bonding part 7 of the other holding component 1. The holding object 25 can thereby be held. COPYRIGHT: (C)2010,JPO&INPIT
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