发明名称 PACKAGE FOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a package for a light emitting device that maintains its emission intensity at a sufficiently high state, and to provide a method of manufacturing the same. <P>SOLUTION: The package for a light emitting device has a ceramic substrate 2 including glass and a ceramic frame 3 installed on an upper surface 2a of the substrate 2, wherein a cavity 3a for housing the light emitting element is formed inside the frame 3, part of glass included in the substrate 2 is deposited in a region within the upper surface 2a of the substrate 2 and at a bottom of the cavity 3a, and a crystallinity degree of the deposited glass is &ge;3%. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010199183(A) 申请公布日期 2010.09.09
申请号 JP20090040493 申请日期 2009.02.24
申请人 SANYO ELECTRIC CO LTD;SANYO DENPA KOGYO KK 发明人 HITOMI TAKUMA;HONGO MASAKI;ITO HIDEKI;YAMAGOSHI KIYOSHI;FUKUYAMA MASAMI;TAKAGI HIDEKI
分类号 H01L33/60;C04B35/18 主分类号 H01L33/60
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