| 摘要 |
<P>PROBLEM TO BE SOLVED: To make a bonding material which is set to be less likely to climb up along the inner face of the cavity, and to make a nozzle for introducing the adhesive material easy to inserted into the cavity in a multi layer ceramic substrate provided with a cavity for accommodating an electrical component in a bonded state via a bonding material as underfill resin. <P>SOLUTION: A longitudinal projection 13, extending in parallel to the inner bottom plane 8 of the cavity 4, is formed in the inside face 12a of the cavity 4 so as not to prevent the adhesive material 9 from climbing over the project 13. A projection 13 is not formed on at least one inside plane 12b in the cavity 4, for leave a space that allows the nozzle 18 for introducing the adhesive material to be inserted in the cavity 4. <P>COPYRIGHT: (C)2010,JPO&INPIT |
