发明名称 BONDING DEVICE AND TAPE SUPPLY TUBE
摘要 <P>PROBLEM TO BE SOLVED: To provide a tape supply tube through which a bonding tape passes stably with a low sliding resistance without increasing the sliding resistance for the bonding tape passing through the tape supply tube. <P>SOLUTION: In a bonding device 1 including a bonding head 10, a tape supply device 20, and the tape supply tube 40 which guides the inserted bonding tape 30 from the tape supply device 20 to the bonding head 10, a pair of protrusions 41 and 41 protruding inward are formed on the inner circumferential surface of the tape supply tube 40 along the length direction of the tape supply tube 40, the protrusions 41 and 41 are arranged at positions facing each other and abut on the respective surfaces of the bonding tape 30 with a width smaller than that of the bonding tape 30 which is inserted into the tape supply tube 40. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010199327(A) 申请公布日期 2010.09.09
申请号 JP20090043045 申请日期 2009.02.25
申请人 TOYOTA MOTOR CORP 发明人 MATSUBARA HIRONARI
分类号 H01L21/60 主分类号 H01L21/60
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