| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the substrate bending resistance of a package housing an electronic component. Ž<P>SOLUTION: The electronic component 1 has the package formed by joining a base 3 formed of glass to a lid 2. In a cavity 13, a crystal vibrator 6 is supported and sealed. The crystal vibrator 6 has an electrode, and the electrode is electrically connected to a bottom of the base 3 by through-electrodes 7 and 17. At a bottom of the through-electrode 7, an end of the through electrode 7 is electrically and physically joined to one end 12 of a lead terminal 9 through a joint 8. A bent part 10 is formed between one end 12 and the other end 11 of the through-electrode 7, and the other end 11 is joined to a circuit board. After the electronic component 1 is fitted to the circuit board, stress generated in the electronic component 1 is reduced by the elasticity of the bent part 10 if an external force is made to act on the electronic component 1 with the circuit board warped and so on, so that damage to the electronic component 1 is suppressed. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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