发明名称 METHOD OF MANUFACTURING LEAD FRAME FOR CAPACITORS, AND LEAD FRAME FOR CAPACITORS
摘要 PROBLEM TO BE SOLVED: To make it possible to set the thickness of a thin plate portion to a predetermined thickness or less and set the width of a thick plate portion to a predetermined width or less and apply a material having high hardness. SOLUTION: There is provided a method of manufacturing a lead frame for capacitors in which a capacitor element including a positive electrode lead line protruded from the side surface and a negative electrode exposed to the side surface is built. A metal plate section and a cutting member are transferred relatively along the longitudinal direction of the metal plate section while pressing the cutting member against a portion of the principal surface of the planar metal plate section and a thick plate portion which is connected to the positive electrode lead line and a thin plate portion which is connected to the negative electrode are formed. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010199360(A) 申请公布日期 2010.09.09
申请号 JP20090043546 申请日期 2009.02.26
申请人 HITACHI CABLE PRECISION CO LTD 发明人 TAKAHASHI GOSUKE;KATO OSAMU;AIDA MASATO
分类号 H01G9/15;H01G13/00 主分类号 H01G9/15
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