发明名称 |
METHOD OF MANUFACTURING LEAD FRAME FOR CAPACITORS, AND LEAD FRAME FOR CAPACITORS |
摘要 |
PROBLEM TO BE SOLVED: To make it possible to set the thickness of a thin plate portion to a predetermined thickness or less and set the width of a thick plate portion to a predetermined width or less and apply a material having high hardness. SOLUTION: There is provided a method of manufacturing a lead frame for capacitors in which a capacitor element including a positive electrode lead line protruded from the side surface and a negative electrode exposed to the side surface is built. A metal plate section and a cutting member are transferred relatively along the longitudinal direction of the metal plate section while pressing the cutting member against a portion of the principal surface of the planar metal plate section and a thick plate portion which is connected to the positive electrode lead line and a thin plate portion which is connected to the negative electrode are formed. COPYRIGHT: (C)2010,JPO&INPIT
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申请公布号 |
JP2010199360(A) |
申请公布日期 |
2010.09.09 |
申请号 |
JP20090043546 |
申请日期 |
2009.02.26 |
申请人 |
HITACHI CABLE PRECISION CO LTD |
发明人 |
TAKAHASHI GOSUKE;KATO OSAMU;AIDA MASATO |
分类号 |
H01G9/15;H01G13/00 |
主分类号 |
H01G9/15 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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