发明名称 MULTILAYER CHIP BALUN DEVICE
摘要 PROBLEM TO BE SOLVED: To further reduce a device size with a coupled line being easily shortened to a length of λ/4 or shorter, and to eliminate deterioration of characteristics, as well as to carry out adjustment of a used frequency with ease and at low cost. SOLUTION: In a multilayer chip balun device, there are buried a set of a first coupled line 30 and a third coupled line 34 and a set of a second coupled line 20 and a fourth coupled line 16, each of which is electromagnetically coupled with the other and has a length of λ/4 or shorter (λ: used wavelength) in such a manner that the sets of lines are overlaid vertically with respect to a mounting surface inside a dielectric chip. One end of the first coupled line is connected to an unbalanced terminal and the other end of it is led to the second coupled line. The other end of the second coupled line is open, and both ends of the third and fourth coupled lines are connected between balanced terminals and ground terminals, respectively. The first coupled line is connected to the second coupled line via an inductor pattern 26. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010199894(A) 申请公布日期 2010.09.09
申请号 JP20090041466 申请日期 2009.02.24
申请人 FDK CORP 发明人 NISHIZAWA HIROBUMI;OKUBO NAOKI
分类号 H01P5/10;H01F17/00;H01F19/06 主分类号 H01P5/10
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