发明名称 Two-step welding method
摘要 The method for welding a deeper lying area (7) of a substrate (4) of component (1, 120, 130, 155) using a welding material (13) and a welding device, comprises applying the welding material extensively on the substrate in the area and melting the applied welding material through the welding device. The welding material is a powder and is applied as a film. The welding material is melted by a laser or an electron radiation source. The welding device or the welding beam and the welding material carry a relative movement against each other. The method for welding a deeper lying area (7) of a substrate (4) of component (1, 120, 130, 155) using a welding material (13) and a welding device, comprises applying the welding material extensively on the substrate in the area and melting the applied welding material through the welding device. The welding material is a powder and is applied as a film. The welding material is melted by a laser or an electron radiation source. The welding device or the welding beam and the welding material carry a relative movement against each other. No material supply takes place during melting the welding material. The welding material is applied over the molten and hardened welding material. The welding material is applied for completely processing the area. Contour is produced on a surface of the substrate.
申请公布号 EP2226149(A1) 申请公布日期 2010.09.08
申请号 EP20090003104 申请日期 2009.03.04
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 ANTON, REINER, DR.;GRUEGER, BIRGIT;HEINECKE, BRIGITTE, DR.;SEEGER, DIRK MARTIN, DR.
分类号 B23K15/00;B23K26/34;B23P6/00;F01D5/00 主分类号 B23K15/00
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